Divestiture • Semiconductors

Vance Street Capital Acquires Semicoa

On August 24, 2009, private equity firm Vance Street Capital acquired semiconductors company Semicoa from Microsemi

Acquisition Context
  • This is Vance Street Capital’s 1st transaction in the Semiconductors sector.
  • This is Vance Street Capital’s 3rd transaction in the United States.
  • This is Vance Street Capital’s 2nd transaction in California.

Explore All 203 Divestiture Semiconductors Deals - Search the Database Free


M&A Deal Summary

Date August 24, 2009
Target Semicoa
Sector Semiconductors
Buyer(s) Vance Street Capital
Sellers(s) Microsemi
Deal Type Divestiture

Target Company

Semicoa

Costa Mesa, California, United States
Semicoa Corp. is a provider of high-reliability discrete semiconductor components for a variety of applications in military, aerospace and industrial markets.
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Buyer Overview 1

Buyer

Vance Street Capital

Pacific Palisades, California, United States

Investor Investor Investor Investor Investor


Category Private Equity Firm
Founded 2007
Size Small
Type Sector Focused
DESCRIPTION

Vance Street Capital is a private equity firm focused on acquiring mid-market, profitable businesses in the aerospace, defense, industrial, and medical technology sectors. Vance Street looks for companies valued from $30 to $350 million with sustainable competitive advantages and proven management. Prospective transaction situations include recapitalizations, management buyouts, corporate divestitures, industry consolidations, and growth capital financings. Vance Street Capital was formed in 2007 and is based in Los Angeles, California.


Deal Context for Buyer #
Overall 3 of 34
Sector: Semiconductors 1 of 1
Type: Divestiture 1 of 3
State: California 2 of 5
Country: United States 3 of 29
Year: 2009 2 of 3
PREVIOUS DEAL
DATE TARGET DEAL TYPE VALUE
2009-01-01 Micross Components

Orlando, Florida, United States

Micross Components serves the aerospace, defense, space, medical, and industrial markets, among others. The company offers an industry-leading portfolio of high-reliability components and services that include advanced component testing, qualification services, packaging services, standard wafer bumping, advanced wafer-level packaging services, and 3D integration. Micross has longstanding relationships with blue-chip customers in each of its end markets and more than 30 of the world's leading semiconductor manufacturers.

Buy -
FOLLOWING DEAL
DATE TARGET DEAL TYPE VALUE
2009-10-01 Secure Technology Co.

Santa Ana, California, United States

Secure Technology Company (“Secure”) is a designer and manufacturer of customized information assurance equipment, C4ISR systems, high bandwidth wireless communication equipment, wireless audio, video and recording products as well as custom platform driven EMS components.

Buy -

Seller Profile 1

SELLER

Microsemi

Chandler, Arizona, United States

Category Company
Founded 1960
Sector Semiconductors
DESCRIPTION
Entrance to Microsemi's corporate headquarters in Aliso Viejo, California.
Entrance to Microsemi's corporate headquarters in Aliso Viejo, California.

Microsemi offers a comprehensive portfolio of semiconductor and system solutions for communications, defense & security, aerospace, and industrial markets. Microsemi was established in 1960 and is based in Chandler, Arizona.


Deal Context for Seller #
Overall 1 of 4
Sector: Semiconductors 1 of 3
Type: Divestiture 1 of 4
State: California 1 of 1
Country: United States 1 of 4
Year: 2009 1 of 1
PREVIOUS DEAL
DATE TARGET DEAL TYPE VALUE
2009-06-08 Nexsem

Irvine, California, United States

Nexsem, Inc. is a semiconductor designer and marketer of high voltage DC to DC conversion devices targeted at the traditionally fast growing commercial markets such as the: LCD-TV, Set Top Box, Notebook and Netbook, and other high-volume commercial applications.

Buy -
FOLLOWING DEAL
DATE TARGET DEAL TYPE VALUE
2010-04-30 White Electronic Designs

Phoenix, Arizona, United States

White Electronic Designs Corp. is a designer, manufacturer and marketer of sophisticated multi-chip semiconductor packages, high-efficiency memory devices, and build-to-print electromechanical assemblies for defense and aerospace applications.

Buy $163M