M&A Deal Summary

Vance Street Capital Acquires Process Fab

On April 17, 2008, private equity firm Vance Street Capital acquired aerospace company Process Fab

Acquisition Highlights
  • This is Vance Street Capital’s 1st transaction in the Aerospace sector.
  • This is Vance Street Capital’s 1st transaction in the United States.
  • This is Vance Street Capital’s 1st transaction in California.
Investment Fate
  • Process Fab was sold to a strategic buyer in 2014.

M&A Deal Summary

Date 2008-04-17
Target Process Fab
Sector Aerospace
Buyer(s) Vance Street Capital
Deal Type Buyout (LBO, MBO, MBI)

Target

Process Fab

Santa Fe Springs, California, United States
Process Fab, Inc. is an engineering, design and manufacturing firm that provides airframe structures, flight hardware, ground support equipment and tooling to the aerospace industry.

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Buyer(S) 1

Buyer

Vance Street Capital

Pacific Palisades, California, United States

Investor Investor Investor Investor Investor


Category Private Equity Firm
Founded 2007
Size Small
Type Sector Focused
DESCRIPTION

Vance Street Capital is a private equity firm focused on acquiring mid-market, profitable businesses in the aerospace, defense, industrial, and medical technology sectors. Vance Street looks for companies valued from $30 to $350 million with sustainable competitive advantages and proven management. Prospective transaction situations include recapitalizations, management buyouts, corporate divestitures, industry consolidations, and growth capital financings. Vance Street Capital was formed in 2007 and is based in Los Angeles, California.


DEAL STATS #
Overall 1 of 34
Sector: Aerospace M&A 1 of 7
Type: Buyout (LBO, MBO, MBI) M&A Deals 1 of 17
State: California M&A 1 of 5
Country: United States M&A 1 of 29
Year: 2008 M&A 1 of 1
FOLLOWING DEAL
DATE TARGET DEAL TYPE VALUE
2009-01-01 Micross Components

Orlando, Florida, United States

Micross Components serves the aerospace, defense, space, medical, and industrial markets, among others. The company offers an industry-leading portfolio of high-reliability components and services that include advanced component testing, qualification services, packaging services, standard wafer bumping, advanced wafer-level packaging services, and 3D integration. Micross has longstanding relationships with blue-chip customers in each of its end markets and more than 30 of the world's leading semiconductor manufacturers.

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