M&A Deal Summary

W.C. Heraeus Acquires Kulicke & Soffa - Wireless Business Unit

On September 29, 2008, W.C. Heraeus acquired communications company Kulicke & Soffa - Wireless Business Unit from Kulicke & Soffa for 165M USD

Acquisition Highlights
  • This is W.C. Heraeus’ 1st transaction in the Communications sector.
  • This is W.C. Heraeus’ largest (disclosed) transaction.
  • This is W.C. Heraeus’ 2nd transaction in the United States.

M&A Deal Summary

Date 2008-09-29
Target Kulicke & Soffa - Wireless Business Unit
Sector Communications
Buyer(s) W.C. Heraeus
Sellers(s) Kulicke & Soffa
Deal Type Divestiture
Deal Value 165M USD

Search 214,356 Deals Now

SEARCH BY

  • Buyer Type (PE or Strategic)
  • Deal Size ($10M to $10B+)
  • Sector (60 Sectors)
  • Deal Type
  • Geography
  • & More

Try Free

Buyer(S) 1

Buyer

W.C. Heraeus

Hanau, Germany

Category Company
Founded 1851
Sector Metals/Mining
DESCRIPTION

W.C. Heraeus GmbH is a provider of precious metals and technology group.


DEAL STATS #
Overall 2 of 2
Sector: Communications M&A 1 of 1
Type: Divestiture M&A Deals 1 of 1
Country: United States M&A 2 of 2
Year: 2008 M&A 1 of 1
Size (of disclosed) 1 of 1
PREVIOUS DEAL
DATE TARGET DEAL TYPE VALUE
2000-05-29 Heraeus Metal Processing

Santa Fe Springs, California, United States

Heraeus Metal Processing, Inc. is a manufacturer of chemical compounds of platinum, palladium, rhodium, iridium, ruthenium, gold, and silver for processing and laboratory scale research.

Buy -

Seller(S) 1

SELLER

Kulicke & Soffa

Washington, Pennsylvania, United States

Category Company
Founded 1951
Sector Semiconductors
Employees2,677
Revenue 706M USD (2024)
DESCRIPTION

Kulicke & Soffa is a designer and manufacturer of semiconductor assembly equipment. Kulicke and Soffa Industries was founded in 1951 and is based in Washington, Pennsylvania.


DEAL STATS #
Overall 3 of 3
Sector: Communications M&A 1 of 1
Type: Divestiture M&A Deals 3 of 3
Country: United States M&A 3 of 3
Year: 2008 M&A 1 of 1
Size (of disclosed) 1 of 2
PREVIOUS DEAL
DATE TARGET DEAL TYPE VALUE
2006-10-12 Alphasem AG

Berg, Switzerland

Alphasem AG is a provider of die bonder equipment and MEMS packaging equipment. In order to maintain its technical leadership, the company invests substantially in research and development.

Buy $30M
FOLLOWING DEAL
DATE TARGET DEAL TYPE VALUE
2008-10-06 Orthodyne Electronics

Irvine, California, United States

Orthodyne Electronics Corp. is a provider of wedge bonders and wedges for the power management and hybrid module markets.

Buy -