M&A Deal Summary |
|
|---|---|
| Date | 2004-02-10 |
| Target | FlipChip International |
| Sector | Semiconductors |
| Buyer(s) | RoseStreet Labs |
| Sellers(s) |
Kulicke & Soffa
Delco Electronics |
| Deal Type | Divestiture |
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RSL manufactures of semiconductor wafer level packaging, photovoltaics, LED lighting and life sciences with strategic investments, intellectual property development, and the formation of three Joint Ventures.
| DEAL STATS | # |
|---|---|
| Overall | 1 of 1 |
| Sector: Semiconductors M&A | 1 of 1 |
| Type: Divestiture M&A Deals | 1 of 1 |
| State: Arizona M&A | 1 of 1 |
| Country: United States M&A | 1 of 1 |
| Year: 2004 M&A | 1 of 1 |
| DATE | TARGET | DEAL TYPE | VALUE |
|---|---|---|---|
| 2015-05-01 |
FlipChip International
Phoenix, Arizona, United States FlipChip International LLC is a provider of bumping and Wafer Level Packaging. |
Sell | - |
| Category | Company |
|---|---|
| Founded | 1951 |
| Sector | Semiconductors |
| Employees | 2,677 |
| Revenue | 706M USD (2024) |
Kulicke & Soffa is a designer and manufacturer of semiconductor assembly equipment. Kulicke and Soffa Industries was founded in 1951 and is based in Washington, Pennsylvania.
| DEAL STATS | # |
|---|---|
| Overall | 1 of 3 |
| Sector: Semiconductors M&A | 1 of 2 |
| Type: Divestiture M&A Deals | 1 of 3 |
| State: Arizona M&A | 1 of 1 |
| Country: United States M&A | 1 of 3 |
| Year: 2004 M&A | 1 of 1 |
| DATE | TARGET | DEAL TYPE | VALUE |
|---|---|---|---|
| 2002-12-01 |
Probe Technology
San Jose, California, United States Probe Technology manufactures testing products for the microprocessor and telecommunications industries. The company offers a full line of probe cards and specializes in small pad and pitch requirement, high pin count and multi-die probe cards. |
Buy | - |
| DATE | TARGET | DEAL TYPE | VALUE |
|---|---|---|---|
| 2006-01-26 |
K&S Wafer Test Assets
United States
|
Sell | $10M |
Delco Electronics Corp. is a manufactures of Integrated circuits of advanced wafer level packaging solutions.
| DEAL STATS | # |
|---|---|
| Overall | 1 of 1 |
| Sector: Semiconductors M&A | 1 of 1 |
| Type: Divestiture M&A Deals | 1 of 1 |
| State: Arizona M&A | 1 of 1 |
| Country: United States M&A | 1 of 1 |
| Year: 2004 M&A | 1 of 1 |
| DATE | TARGET | DEAL TYPE | VALUE |
|---|---|---|---|
| 1996-01-01 |
FlipChip International
Phoenix, Arizona, United States FlipChip International LLC is a provider of bumping and Wafer Level Packaging. |
Buy | - |
