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  6. Novellus Systems Acquires Angstron Systems

M&A Deal Summary

Novellus Systems Acquires Angstron Systems

On April 12, 2004, Novellus Systems acquired semiconductors company Angstron Systems

Acquisition Highlights
  • This is Novellus Systems’ 3rd transaction in the Semiconductors sector.
  • This is Novellus Systems’ 3rd transaction in the United States.
  • This is Novellus Systems’ 2nd transaction in California.

M&A Deal Summary
Date 2004-04-12
Target Angstron Systems
Sector Semiconductors
Buyer(s) Novellus Systems
Deal Type Add-on Acquisition

Target

Angstron Systems

Santa Clara, California, United States
Angstron Systems, Inc. is a supplier of atomic layer deposition (ALD) technology for advanced semiconductor manufacturing. Angstron's ion-induced ALD technology will be integrated on Novellus' INOVA xT platform, boosting the market momentum of this successful platform and strengthening Novellus' copper barrier/seed product portfolio for advanced technology applications.

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Buyer(S) 1

Buyer

Novellus Systems

San Jose, California, United States
Category Company
Founded 1984
Sector Semiconductors
DESCRIPTION

Novellus Systems, Inc. is a manufacturer of chemical vapor deposition (CVD), physical vapor deposition (PVD) and copper electrofill systems. Novellus products provide solutions to both the productivity and quality problems facing the worldwide semiconductor manufacturing industry today.

DEAL STATS #
Overall 3 of 3
Sector: Semiconductors M&A 3 of 3
Type: Add-on Acquisition M&A Deals 3 of 3
State: California M&A 2 of 2
Country: United States M&A 3 of 3
Year: 2004 M&A 1 of 1
PREVIOUS DEAL
DATE TARGET DEAL TYPE VALUE
2002-08-12 SpeedFam-IPEC

Phoenix, Arizona, United States

SpeedFam-IPEC, Inc. is a supplier of CMP systems used in the fabrication of advanced copper interconnects. SpeedFam-IPEC manufactures chemical mechanical planarization (CMP) systems used in the fabrication of advanced semiconductor devices. With more than 1,300 CMP systems installed worldwide, SpeedFam-IPEC enables the development of next-generation integrated circuit technology through its leading-edge polishing systems.

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