M&A Deal Summary

Naprotek Acquires Microfab

On August 9, 2022, Naprotek acquired semiconductors company Microfab

Acquisition Highlights
  • This is Naprotek’s 2nd transaction in the Semiconductors sector.
  • This is Naprotek’s 3rd transaction in the United States.
  • This is Naprotek’s 2nd transaction in New Hampshire.

M&A Deal Summary

Date 2022-08-09
Target Microfab
Sector Semiconductors
Buyer(s) Naprotek
Deal Type Add-on Acquisition

Target

Microfab

Manchester, New Hampshire, United States
Microfab is a provider of precision RF circuit fabrication and atomic-level micro machining services. The company provides ion beam etching, plating, dicing, and micro-machining services and thin film components for communications, microwave, biomedical sensors, and fiber optics applications serving the Defense, Medical, and Telecom markets. Microfab was founded in 1999 and is based in Manchester, New Hampshire.

Search 200,500 Deals Now

SEARCH BY

  • Buyer Type (PE or Strategic)
  • Deal Size ($10M to $10B+)
  • Sector (60 Sectors)
  • Deal Type
  • Geography
  • & More

Try For Free 7-Day Free Trial

Buyer(S) 1

Buyer

Naprotek

San Jose, California, United States

Category Company
Founded 1995
Sector Semiconductors
DESCRIPTION

Naprotek is an electronic manufacturing services company and a provider of quick turn PCBA, design for manufacturability, system integration, and testing services for high-reliability applications. Naprotek was founded in 1995 and is based in San Jose, California.


DEAL STATS #
Overall 3 of 3
Sector (Semiconductors) 2 of 2
Type (Add-on Acquisition) 3 of 3
State (New Hampshire) 2 of 2
Country (United States) 3 of 3
Year (2022) 2 of 2
PREVIOUS DEAL
DATE TARGET DEAL TYPE VALUE
2022-01-13 NexLogic

San Jose, California, United States

NexLogic provides electronics manufacturing services across key markets, including defense, medical, and test and instrumentation, and is uniquely positioned to support automated test equipment and semiconductor providers. Their electronics manufacturing capabilities include design and development of microelectronic packaging, surface mount technology, and higher-level assemblies with in-house automation, test, and inspection.

Buy -