M&A Deal Summary

Linxens SA Acquires Interplex Microtech SAS

On February 17, 2014, Linxens SA acquired electrical equipment company Interplex Microtech SAS from Interplex

Acquisition Highlights
  • This is Linxens SA’s 1st transaction in the Electrical Equipment sector.
  • This is Linxens SA’s 1st transaction in France.

M&A Deal Summary

Date 2014-02-17
Target Interplex Microtech SAS
Sector Electrical Equipment
Buyer(s) Linxens SA
Sellers(s) Interplex
Deal Type Add-on Acquisition

Target

Interplex Microtech SAS

Vorey, France

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Buyer(S) 1

Buyer

Linxens SA

Guyancourt, France

Category Company
Founded 1986
Sector Electrical Equipment
DESCRIPTION

Linxens SA is a manufacturer of connectors for smart cards. Linxens was founded in 1986 and is based in Guyancourt, France.


DEAL STATS #
Overall 1 of 3
Sector: Electrical Equipment M&A 1 of 1
Type: Add-on Acquisition M&A Deals 1 of 2
Country: France M&A 1 of 1
Year: 2014 M&A 1 of 1
FOLLOWING DEAL
DATE TARGET DEAL TYPE VALUE
2016-11-04 Smartrac NV - Secure ID & Transaction

Amsterdam, Netherlands

Smartrac NV - Secure ID & Transaction (SIT) is a manufacturer of RFID inlays and antennas.

Buy -

Seller(S) 1

SELLER

Interplex

Singapore, Singapore

Category Company
Founded 1958
Sector Electrical Equipment
Employees13,000
DESCRIPTION

Interplex is a precision engineering company offering end-to-end solutions in advanced application development and manufacturing solutions for complex precision mechanical and electro-mechanical components and assemblies. Interplex was founded in 1958 and is based in Singapore.


DEAL STATS #
Overall 1 of 1
Sector: Electrical Equipment M&A 1 of 1
Type: Add-on Acquisition M&A Deals 1 of 1
Country: France M&A 1 of 1
Year: 2014 M&A 1 of 1
PREVIOUS DEAL
DATE TARGET DEAL TYPE VALUE
2009-07-10 Interplex QLP

Woburn, Massachusetts, United States

Interplex QLP, Inc. is a electronic packaging and polymer science company. QLP's revolutionary material technology, QuantechTM can be used to provide a lower cost and very reliable air-cavity packaging solution compared to ceramic based packages for the semiconductor packaging industry in applications such as high power RF-Microwave assemblies, image sensors, HB-LEDs, MEMs, and optical electronic systems.

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