M&A Deal Summary |
|
|---|---|
| Date | 2009-10-23 |
| Target | J-Devices |
| Sector | Semiconductors |
| Buyer(s) |
Amkor Technology
Toshiba Nakaya Microdevices |
| Deal Type | Joint Venture |
SEARCH BY
| Category | Company |
|---|---|
| Founded | 1968 |
| Sector | Test/Measurement Equipment |
| Employees | 28,300 |
| Revenue | 6.3B USD (2024) |
Amkor Technology is a provider of contract semiconductor assembly and test services. Amcor's packaging and test services are designed to meet application and chip specific requirements including the type of interconnect technology employed; size; thickness and electrical, mechanical and thermal performance. The Company is able to provide turnkey packaging and test services including semiconductor wafer bump, wafer probe, wafer backgrind, package design, packaging, test and drop shipment services. Amkor Technology was incorporated in 1968 and is based in Tempe, Arizona.
| DEAL STATS | # |
|---|---|
| Overall | 7 of 9 |
| Sector: Semiconductors M&A | 7 of 9 |
| Type: Joint Venture M&A Deals | 2 of 2 |
| Country: Japan M&A | 3 of 3 |
| Year: 2009 M&A | 1 of 1 |
| DATE | TARGET | DEAL TYPE | VALUE |
|---|---|---|---|
| 2004-08-24 |
Unitive
Morrisville, North Carolina, United States Unitive, Inc. is an independent developer of electroplated wafer bumping technology. Unitive also operates the industry's most advanced turnkey capability for wafer level chip packaging, providing an integrated suite of services, including design, wafer bumping, multi-layer redistribution, backgrind, dicing, probe, tape & reel, backside laminate & metallization and laser marking. |
Buy | - |
| DATE | TARGET | DEAL TYPE | VALUE |
|---|---|---|---|
| 2011-09-29 |
Toshiba Electronics Malaysia Sdn. Bhd.
Kuala Langat, Malaysia Toshiba Electronics Malaysia Sdn. Bhd. is a supplier of packaging and test services for certain discrete semiconductor products and analog LSI products. |
Buy | - |
| Category | Company |
|---|---|
| Founded | 1875 |
| Sector | Electronics |
| Employees | 116,224 |
| Revenue | 3.34T JPY (2022) |
Toshiba is a multinational engineering and electronics conglomerate. The Company manufactures and sells cellular phones, hard disc devices, optical disc devices, and televisions amongst other products. Toshiba was founded in 1875 and is based in Tokyo, Japan.
| DEAL STATS | # |
|---|---|
| Overall | 2 of 6 |
| Sector: Semiconductors M&A | 2 of 2 |
| Type: Joint Venture M&A Deals | 2 of 2 |
| Country: Japan M&A | 2 of 2 |
| Year: 2009 M&A | 1 of 1 |
| DATE | TARGET | DEAL TYPE | VALUE |
|---|---|---|---|
| 2007-10-01 |
Ekitan
Tokyo, Japan Ekitan is a provider of information and data processing services using the Internet. Ekitan was incorporated in 1997 and is based in Tokyo, Japan. |
Sell | - |
| DATE | TARGET | DEAL TYPE | VALUE |
|---|---|---|---|
| 2011-05-19 |
Landis+Gyr AG
Zug, Switzerland Landis & Gyr (Europe) AG develops and manufactures payphones and remote transaction systems for payphone operators, site providers, and equipment integrators. |
Buy | $2.3B |
Nakaya Microdevices Ltd. is one of Japan's top independent outsourced semiconductor assembly and testing service providers.
| DEAL STATS | # |
|---|---|
| Overall | 1 of 1 |
| Sector: Semiconductors M&A | 1 of 1 |
| Type: Joint Venture M&A Deals | 1 of 1 |
| Country: Japan M&A | 1 of 1 |
| Year: 2009 M&A | 1 of 1 |
