M&A Deal Summary

Amkor Technology Acquires Unitive

On August 24, 2004, Amkor Technology acquired semiconductors company Unitive

Acquisition Highlights
  • This is Amkor Technology’s 6th transaction in the Semiconductors sector.
  • This is Amkor Technology’s 1st transaction in the United States.
  • This is Amkor Technology’s 1st transaction in North Carolina.

M&A Deal Summary
Date 2004-08-24
Target Unitive
Sector Semiconductors
Buyer(s) Amkor Technology
Deal Type Add-on Acquisition

Target

Unitive

Morrisville, North Carolina, United States
Unitive, Inc. is an independent developer of electroplated wafer bumping technology. Unitive also operates the industry's most advanced turnkey capability for wafer level chip packaging, providing an integrated suite of services, including design, wafer bumping, multi-layer redistribution, backgrind, dicing, probe, tape & reel, backside laminate & metallization and laser marking.

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Buyer(S) 1

Buyer

Amkor Technology

Tempe, Arizona, United States

website

Category Company
Founded 1968
Sector Test/Measurement Equipment
Employees31,300
Revenue 7.1B USD (2022)
DESCRIPTION

Amkor Technology is a provider of contract semiconductor assembly and test services. Amcor's packaging and test services are designed to meet application and chip specific requirements including the type of interconnect technology employed; size; thickness and electrical, mechanical and thermal performance. The Company is able to provide turnkey packaging and test services including semiconductor wafer bump, wafer probe, wafer backgrind, package design, packaging, test and drop shipment services. Amkor Technology was incorporated in 1968 and is based in Tempe, Arizona.

DEAL STATS #
Overall 6 of 9
Sector (Semiconductors) 6 of 9
Type (Add-on Acquisition) 3 of 4
State (North Carolina) 1 of 1
Country (United States) 1 of 1
Year (2004) 1 of 1
PREVIOUS DEAL
DATE TARGET DEAL TYPE VALUE
2002-01-24 Citizen Watch - Assembly Business

Japan

Citizen Watch - Assembly Business operates as a third party subcontractor, providing advanced IC packaging for a broad range of Japanese semiconductor companies.

Buy -
FOLLOWING DEAL
DATE TARGET DEAL TYPE VALUE
2009-10-23 J-Devices

Usuki City, Japan

J-Devices Corp. is a provider of semiconductor assembly and test services.

Buy -
Mergr

Product

Company

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