M&A Deal Summary |
|
|---|---|
| Date | 2017-02-02 |
| Target | NANIUM S.A. |
| Sector | Semiconductors |
| Buyer(s) | Amkor Technology |
| Deal Type | Add-on Acquisition |
SEARCH BY
Try For Free 7-Day Free Trial
| Category | Company |
|---|---|
| Founded | 1968 |
| Sector | Test/Measurement Equipment |
| Employees | 28,700 |
| Revenue | 6.5B USD (2023) |
Amkor Technology is a provider of contract semiconductor assembly and test services. Amcor's packaging and test services are designed to meet application and chip specific requirements including the type of interconnect technology employed; size; thickness and electrical, mechanical and thermal performance. The Company is able to provide turnkey packaging and test services including semiconductor wafer bump, wafer probe, wafer backgrind, package design, packaging, test and drop shipment services. Amkor Technology was incorporated in 1968 and is based in Tempe, Arizona.
| DEAL STATS | # |
|---|---|
| Overall | 9 of 9 |
| Sector (Semiconductors) | 9 of 9 |
| Type (Add-on Acquisition) | 4 of 4 |
| Country (Portugal) | 1 of 1 |
| Year (2017) | 1 of 1 |
| DATE | TARGET | DEAL TYPE | VALUE |
|---|---|---|---|
| 2011-09-29 |
Toshiba Electronics Malaysia Sdn. Bhd.
Kuala Langat, Malaysia Toshiba Electronics Malaysia Sdn. Bhd. is a supplier of packaging and test services for certain discrete semiconductor products and analog LSI products. |
Buy | - |
